Pingxiang Lianjin Cheng Technology Co., Ltd
Pingxiang Lianjin Cheng Technology Co., Ltd
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A Multilayer Printed Circuit Board is an essential component in the world of electronics, providing a sturdy and reliable platform for various electronic devices. Our Multilayer PCB product offers exceptional quality and performance, designed to meet the demands of modern technology.
With a maximum board size of 1200*6100mm, our Multilayer PCB is suitable for a wide range of applications, from small electronic gadgets to large industrial equipment. The ample size allows for flexibility in designing and assembling complex electronic circuits.
Our Multilayer PCB features 10 layers, providing ample space for intricate circuit designs and ensuring optimal signal transmission and power distribution. The multiple layers allow for better thermal management, reducing the risk of overheating and enhancing overall reliability.
When it comes to aesthetics, our Multilayer PCB offers a variety of soldermask colors to choose from, including white, black, red, blue, yellow, purple, and more. This allows for customization and branding opportunities, ensuring that the PCB matches the overall design theme of the electronic device.
The legend on our Multilayer PCB is white, providing clear visibility and easy identification of components and connections. This helps streamline the assembly process and reduces the risk of errors during manufacturing and testing.
In terms of thickness, our Multilayer PCB ranges from 0.2mm to 6.0mm, offering flexibility in design while maintaining structural integrity. The varying thickness options cater to different application requirements, from slim and compact devices to robust industrial machinery.
Whether you are designing a consumer electronics product, a telecommunications device, or an automotive system, our Multilayer Printed Circuit Board is a reliable and high-performance solution. With its impressive specifications and quality construction, our Multilayer PCB is sure to meet your expectations and exceed industry standards.
| Attribute | Value |
|---|---|
| Max Board Size | 1200*6100mm |
| Number of Layers | 2-20 |
| Type Of Assembly | SMT And Thru-hole |
| Number Of Layer | 10 Layers |
| Silkscreeen | White |
| Copper Thickness | 1 Oz |
| Solder Mask | Black |
| Specialized In | High-precision |
| Thickness | 0.2mm-6.0mm |
| Min. Silkscreen Clearance | 0.1mm |
A Multilayer Printed Circuit Board, also known as a Multilayer PCB, is a versatile and essential component in various electronic devices and applications. With its unique attributes, a 10-layer Multilayer PCB offers a high level of complexity and functionality, making it suitable for a wide range of product application occasions and scenarios.
One of the key attributes of a 10-layer Multilayer PCB is its ability to accommodate intricate circuit designs and connections. The multiple layers allow for increased signal routing capabilities, making it ideal for applications requiring high-density interconnections and signal integrity.
With a Copper Thickness of 1 Oz and Outer Copper Weight of 1 Oz, this Multilayer PCB provides excellent conductivity and reliability. The balanced copper distribution ensures stable performance and optimal signal transmission, making it suitable for applications where signal integrity is crucial.
The Type of Assembly supported by this Multilayer PCB includes SMT (Surface Mount Technology) and Thru-hole, offering flexibility in component mounting options. This versatility makes it compatible with a wide range of electronic components and assembly techniques, catering to diverse application requirements.
Furthermore, the Thickness range of 0.2mm-6.0mm provides flexibility in design and integration, making the Multilayer PCB suitable for applications with varying space constraints and form factors. Whether it is a compact consumer electronic device or a complex industrial system, the 10-layer Multilayer PCB can be tailored to meet specific size and performance requirements.
Overall, the Multilayer Printed Circuit Board is a critical component in modern electronics, offering advanced functionality and reliability. Its versatility, high performance, and compatibility with different assembly methods make it an ideal choice for a wide range of product application occasions and scenarios.