High-Density Interconnect (HDI) Technology
Characterized by microvias with a diameter ≤0.15mm, High-Density Interconnect (HDI) employs advanced fine-line patterning and microvia formation technologies to enable component interconnection within ultra-compact form factors. The architectural design—featuring minimized conductor geometries and optimized layer stacking—facilitates a wiring density an order of magnitude higher than conventional printed circuit boards (PCBs), critical for high-performance miniaturized systems.
Electrical performance is substantially enhanced through precise control of parasitic effects: reduction of residual stub inductance, elimination of discrete decoupling capacitors via integrated power/ground planes, and mitigation of crosstalk through controlled impedance routing. Furthermore, the strategic placement of adjacent ground planes—enabled by HDI’s thin dielectric layers—reduces radiated electromagnetic interference (RFI/EMI) by minimizing loop inductance and ensuring uniform distributed capacitance, thereby optimizing signal integrity across high-frequency transmission paths.
