Huashengxin Circuit Limited

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2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly

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City:shenzhen
Province/State:guangdong
Country/Region:china
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2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly

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Brand Name :Huashengxin
Model Number :ED9A8114
Certification :UL , ISO9001
Place of Origin :China
MOQ :1pcs
Payment Terms :T/T
Delivery Time :fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Packaging Details :vacuum
PCB Layer :2 Layer Flexible PCBA
Material :PI
Board Layer :2L
Finished treatment :ENIG
Copper thickness :1oz
Minimum drilling size :0.1mm
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2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly

Flex PCB Board 2 Layer Flexible PCBA Flex PCB Assembly Quick Turn PCB Assembly Flexible Pcb Assembly

2 Layer Flexible PCBA

Flexible printed circuits are circuit boards that have the ability to bend or twist. From this assertion, it is obvious that they are distinguished by a flexible construction. That is why electronic engineers and designers use them in applications that demand for their qualities. They are also referred to as flex circuits and are mostly used in small electronic applications. Since they are characterized by their ability to bend, flexible printed circuits are made of flexible substrate such as polyimide. Another important quality of flexible printed circuits is that they have superior heat dissipation than printed circuit boards. It is this quality that makes it possible for the electronics that use it to stay in quality condition for a long time.

HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.

FPC Technology Capability
Attribute (All dimensions are mils unless
otherwise specified)
Mass Production (Yield
80%,Cpk1.33)
Small Amount(Yield60%, Key
Specification Yield80%
Sample
FPC(yes/no) yes yes yes
Layer count/Structure, Max. 2 4 6
Size(L×W), Max. 550mm*250mm 550mm*250mm 700mm*250mm
Nominal thickness (mm) 0.1~0.5 0.1~0.5 0.1~0.8
Thickness tolerance ±10%(>0.3mm)/±0.03mm(0.3mm) ±10%(>0.3mm)/±0.03mm(0.3mm) ±10%(>0.3mm)/±0.03mm(0.3mm)
Surface finish type ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold ENIGENEPIGOPSI-SilverI-Tin HASLHard Gold
Soft ENIG(yes/no) no no no
Base material type PI PI PILCPTK
Coverlay thickness (um) 28/50/60/80 28/50/60/80 28/50/60/80
Adhesive thickness (um) 25/40/50/65 25/40/50/65 25/40/50/65
Copper thickness, Min./Max. (um) 12-70 12-70 12-70
Base material thickness, Min./Max. (um) 25-75 25-75 25-100
Mechanical drilled thru-hole size (DHS), Min. 0.15 0.15 0.15
Plating aspect ratio, Max. 3:1 3:1 5:1
Pad size, Min. With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.4mm
Without through hole:0.2mm
With through hole:0.3mm
Without through hole:0.2mm
Pad size tolerance 20% 20% 10%
Pad to pad space, Min. 4mil 4mil 4mil
Pad to outline tolerance ±3mil ±3mil ±2mil
Pattern location accurancy ±3mil ±3mil ±2mil
Pattern location accurancy from top side to bottom ±3mil ±3mil ±2mil
Laser via hole diameter/pad, Min. 4/12mil 4/10mil 4/10mil
Outerlayer(Hoz+plating) line width/space, Min. 3/3mil 3/3mil 2/2mil
Innerlayer(Hoz) line width/space, Min. 3/3mil 3/3mil 2/2mil
Inner line width tolerance ±10% ±10% ±10%
Outerlayer registration, Min. (Pad diameter = DHS + X) DHS + 8 DHS + 8 DHS + 6
Innerlayer registration, Min. (Pad diameter = DHS + X)(L4 layer) DHS + 10 DHS + 10 DHS + 8
Laser via hole pitch, Min. 0.40mm 0.40mm 0.35mm
Mechanical hole pitch, Min. 0.50mm 0.50mm 0.40mm
Drilled hole position tolerance ±2mil ±2mil ±2mil
Hole size tolerance ±2mil ±2mil ±2mil
Location accurancy from tooling hole(PTH&NPTH) to pad ±3mil ±3mil ±2mil
Location accurancy from tooling hole(PTH&NPTH) to outline ±3mil ±3mil ±2mil
Outline size tolerance ±2mil ±2mil ±2mil
LPI registration/dam, Min. 2mil/4mil 2mil/4mil 2mil/3mil
LPI dam on CVL 8mil 8mil 8mil
Coverlay open window/dam Φ0.5mm/0.3mm Φ0.5mm/0.3mm Φ0.3mm/0.2mm
Coverlay registration/Resin flow 4mil 4mil 2mil
Stifferness material FR4/PI/Steel FR4/PI/Steel FR4/PI/Steel
Stifferness dam, Min. 12mil 12mil 8mil
Stifferness registration/Resin flow 8mil/4mil 8mil/4mil 4mil/2mil
Impedance tolerance 10% 10% 5%
Thermal reliability(LPI, FCCL, CVL) 288°/10s/3times 288°/10s/3times 288°/10s/3times
Qualified material and structure UL PI PI PI

2 Layer Flex PCB Board 0.5mm 3mil ENIG Quick Turn PCB Assembly

FAQ:

Q1:Are you a factory or trade company?
A: Yes, we are the factory, we have independent quick turn prototype PCB manufacturing & big volume PCB production lines.

Q2:What kind of PCB file format can you accept for production?
A: Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350, ODB+(.TGZ)

Q3:Are my PCB files safe when I submit them to you for manufacturing?
A: We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from your side, nor we'll share these files with any other 3rd parties. And we could sign NDA with client if necessary.

Q4:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.

Q5:What is your standard lead time for PCB?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days

Q6:What payment do you accept ?
A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)

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