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FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM

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Huashengxin Circuit Limited
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsYang
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FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM

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Brand Name :Huashengxin
Model Number :6L 1+N+1 HDI PCB
Certification :UL , ISO9001
Place of Origin :China
MOQ :1pcs
Payment Terms :T/T
Delivery Time :fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Packaging Details :vacuum
PCB Name :6L 1+N+1 HDI PCB
Marterial :FR-4, TG170
Board Layer :6L
Board Thickness :2.0mm
Finished Copper Weight Outer :3oz
Internal Copper Weight Inner :3oz/105um
IPC Class Required :Class 3
Smallest Hole Size :0.15mm
Blind Vias :Yes
Application :power supplies
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FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM

HDI PCB Board HDI Circuit Boards Rohs PCB PCB And PCBA FR4 PCB Board PCB Printed Circuit Board Assembly

6L 1+N+1 HDI PCB

High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring. They have a faster connection while reducing the size of a project. Normally, these boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. A HDI board can house the functionality of the previous boards used.

HDI Board Stack-up:

1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.
i+N+i (i>=2) PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.

PCB Layer 6L PCB material FR4 TG170
Copper thickness

3/3/3/3/3/3oz

PCB thickness 2.0MM
Min. hole size 0.15mm Min.PCB track/gap: 3mil
PCB solder mask Black PCB silkscreen White
PCB surface finished Immersion Gold PCB outline Routing
Application power supplies
Special requirement: Heavy copper 3OZ/small line space and gap:3/3mil/HDI Buried vias and blind vias, one step stack up /min


FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODMFR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM

FAQ:

1. What service can you provide?

PCB Manufacture,PCB Assembly,Rapid Prototype

2. How fast is your lead time?

Fastest 24H for 2L and 4L, 3WDs for HDI board.

3. How to get quick quotation?

Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)

sample:

PCB Layer 6L
PCB surface IMMERSION GOLD
PCB material FR4, TG170
Copper thickness 3/3/3/3/3/3oz finished
PCB solder mask Double side, Black
PCB silkscreen Double side,White
Special requirement Heavy copper 3OZ/small line space and gap:3/3mil

4.What payment terms do you have?

Wire Transfer(T/T)

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